Key Applitions - High Performance Computing
AI / Deep Learning
  Key Features

1. 
   Dual AMD EPYC™ 7003/7002 Series Processors
   

(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-che™ Technology requires BIOS version 2.3 or newer)
Socket SP3
Supports CPU TDP up to 280W*

2. 
   Core: Up to 128 Cores (64 per CPU)
   
3. 
   Supported GPUs: HGX A100 8-GPU 40GB/80GB SXM4 Multi-GPU Board
   
4. 
   Memory pacity: 32 DIMM slots Up to 8TB 3DS ECC DDR4-3200MH RDIMM/LRDIMM, 3200MHz ECC DDR4 RDIMM/LRDIMM
   
5. 
   Chipset: System on Chip (SoC)
   
6. 
   Network Controllers Provided via AIOM, Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
   
7. 
   Form Factor: 4U Rackmountable, Rackmount Kit (MCP-290-00180-0N)
   
8. 
   Drive Bays: 6 hot-swap U.2 NVMe 2.5" drive bays (4 via PCI-E switch, 2 via CPU, SATA/NVMe Hybrid or SAS with optional HBA) (up to 10 hot-swap U.2 NVMe 2.5" available), 2 M.2 NVMe
   
9. 
   PCI-Express: 8 PCI-E 4.0 x16 via PCI-E switch - supporting HGX A100 8-GPU's 1:1 connection to 8 NICs, 1 PCI-E 4.0 x16 LP and 1 PCI-E 4.0 x8 LP via CPUs
   
10. 
    Power Supply: 3000W Redundant Platinum Level Power Supplies, 80+ Platinum. 
    

Thank you,
Inc,